Redefining Reliability

The Occam Process for high reliability electronics

The Occam Process for high reliability electronics The Occam Process for high reliability electronics The Occam Process for high reliability electronics

The Occam Group (TOG) is bringing its disruptive, solderless assembly technology to industry.

Occam Opportunity

Occam is poised to disrupt electronics

Occam changes the way electronic products are designed and built.

Reverse order processing

Occam fundamentally changes the way components are assembled.

Something much, much better

Occam greatly improves reliability and performance, while significantly reducing product size and costs.

Enabling technology

Occam makes possible a new level of productivity and reliability, allowing electronic products to reach their full potential.

The Occam Process

SAFE

solderless component assembly, high reliability, thermal management, additive manufacturing, mil/aero, defense electronics, medical electronics, automotive electronics, lean manufacturing, high reliability electronics

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