Redefining Reliability
The Occam Process
The Occam Group (TOG) is bringing its disruptive, solderless assembly technology to industry.
The Occam Process
SAFE
Occam’s approach to circuit assembly and circuitization are unique. Occam or SAFE (Solderless Assembly For Electronics) reimagines and redefines how component interconnections are designed, assembled and circuitized. Inherently, Occam solderless assemblies offer greater product reliability, fewer potential process errors, a smaller product footprint while removing a significant number of process steps.
With Occam, components are first attached to a “component board” and tested before encapsulation and circuitization, ensuring that all Occam assemblies are known good at the outset. There are several methods for adding component connections including traditional plating techniques, additive printed circuits (printed electronics) among others.
