Some of the most common manufacturing defects and failures in electronic products are related to solder pads and solder joints, especially in high reliability applications. Many of the failures occur as a result of solder fatigue due to shock and vibration and/or repeated thermal excursions in operation or rework. Tin whiskers are returning as a cause of failure with the advent of lead-free solders, especially as the space between component terminations shrinks. The use of high power devices is on the rise and solder’s high resistance as compared to copper can cause circuitry hotspots. Since Occam is solderless, solder related failures are non-existent. Occam bypasses the weakest link.
Known good from the git-go
The reverse processing order assembles and tests first, encapsulates the known good components then adds the circuits. There are no significant heat or mechanical stresses during the process as presently envisioned and therefore a significant cause of failure is obviated. And since problems are detected and rooted out upfront there is no traditional rework required. Although robust processes are the goal, if needed circuit layers can be inspected and repaired using standard AOI equipment.
From drop test to throw test to bulldozer test (almost)
Occam is ideal for applications where equipment will likely be subjected to significant abuse. Essentially, Occam assemblies will be made into a monolithic brick. As a result, Occam sets a new standard for reliability.
Hermetic, EMI/ESD immune with integral thermal management benefits
Ideally built with a metal substrate, such as aluminum, assemblies have thermal management built in. Moreover, If desired, completed assemblies can be given a final coat of metal providing near total hermeticity, excluding I/O related to connectors for power and data. “Metal jacket” would also provide EMI and ESD protection and could serve the additional function of heat removal, all in service of highest reliability.