EMS Opportunity

Higher Reliability

By removing solder and then encapsulating the assembly the reliability of Occam assemblies is greatly extended for demanding applications. 

Lower Costs

The combining of the circuitry with assembly greatly reduces the total number of process steps needed, providing significant savings. The potential use of lower cost materials along with a significant reduction in process defects and rework will drive waste and therefore cost out of the process. The list of potential overall savings is extensive. Depending on the full bill of materials, a cost reduction from 10-30%  isn’t difficult to imagine.

Smaller Product Footprint

Traditional electronic assembly design typically has relatively stringent rules relative to component placement. The components are placed further apart than necessary to accommodate post assembly cleaning, rework and repair. Without solder components can be placed closer to one another reducing size and saving real estate. Another concern are watt density rules which can be relaxed if the assembly is created on a thermally conductive base.

Time  

The Occam process significantly reduces the time needed to build a highly reliable assembly.  Having a less complicated process and fewer steps with a highly reliable outcome will work to greatly reduce the amount of time wasted commonly experienced in today’s incumbent methodology. A convervative estimate of 10% time savings is likely.

Low Risk

The Occam process will likely take years to become the dominant assembly technology.  Its initial ramp up will mostly take the path of a typical new product introduction. With each new introduction to the customer base, another brick will be added to the Occam wall. We believe the market will eventually drive the speed of Occam adoption as the benefits become more and more apparent. At that point, the challenge will be just keeping up. A well positioned EMS partner along with their licensees will reap the lion’s share of this new, exclusive business.

Same Process tools/equipment

With some modifications, many of today’s process tools and equipment can be used to support Occam assemblies. There are no perceived equipment or material gaps.

Moving to Occam is more a new way of thinking, as a result, a very low capex is required.

Additive Manufacturing ready 

Additive manufacturing is getting increased attention as a means of producing rapid prototypes. Occam is ideally suited to additive/build up manufacturing of electronics for prototypes and short production runs. This equipment exists on the market today. 

Circuit Design

Circuit designers have already developed Occam designs using the tools on hand.  We don’t anticipate design tools to be an issue. Certainly, as with all processes and equipment, some modifications may be required.

First Mover and First to Market Advantages

Being first to market with higher quality, more reliable and lower cost products with a unique capability can provide a significant advantage to an exclusive EMS company. An Occam partner will have the pole position as the industry begins to transition to this significantly better technology.

Onshoring

Occam is U.S. based technology and provides a partner company with new capabilities and a significant technical advantage over the competition. The opportunity for onshoring more manufacturing should offer a partner company a significant strategic advantage. 

New Opportunities

With Occam, more and more opportunities will emerge as the industry “invents” new ways to use this technology.  There are many possibilities yet to be discovered. This is just the beginning!

Environmental

No solder, fewer process steps, lower temperature processing, less energy required, less waste. 

Occam Everywhere

Although well suited for hi-rel electronics, Occam will replace most assemblies going forward. Occam will greatly improve the way we build electronic products, lowering costs across the board, improving reliability, reducing the environmental impact and much more.