Occam inventor Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi).
Some of Fjelstad’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today. He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach (the Occam Process). In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades.
Joe is cited over 10,000 times on Google Scholar.
Ray started working in PCBs in 1978 for several fabricators before starting CircuiTree Magazine in 1987, taking it from an alsoran publication to the leading industry journal in just five years. As a publisher/editor, he has spent a significant amount of time talking to leaders and touring facilities all over the world. That broad perspective has helped him gain a better understanding of the industry as a whole and supported his industry interactions, editorials and articles over the years. In 2004 he began publishing the I-Connect007 family of media products which included SMT Magazine, the PCB Magazine, PCB Design007 and more. In partnership with the IPC, his media company began producing Real-Time with…IPC along with other Real-Time with… events around the world. To date, the company has conducted over 1000 industry interviews at trade shows and conferences all over the globe. He sold his interest in I-Connect007 in 2015. I-Connect007 recently sold to IPC.