While the elimination of solder from the assembly process is not a new concept, previously proposed mechanisms for doing so (e.g., replacing with conductive adhesive) have been largely eschewed by the market, perhaps because of conductivity limits or lack of proven reliability, or possibly due to the fact that solder has been the de facto standard for electronic assembly for decades. But a close examination of electronic assembly technology reveals it to be both possible and practical compared to building far more complex and challenging multichip modules and IC packages using bare die. All materials, equipment and processes required to implement the Occam process are currently readily available and operational. The starkest change to the assembly factory will be simply the importing of a mature process of additive board fabrication.
Eliminating the limiting
Think about all the added costs, performance compromises, non-value effort related to the limitations of solder in the assembly process. The list is quite long. Instead of focusing on all of the workarounds and compromises solder requires, with Occam, the sky’s the limit!
Occam’s approach to circuit assembly and circuitization are unique. Occam or SAFE (Solderless Assembly For Electronics) reimagines and redefines how component interconnections are designed, assembled and circuitized. Inherently, Occam solderless assemblies offer greater product reliability, fewer potential process errors, a smaller product footprint while removing a significant number of process steps.
With Occam, components are first attached to a “component board” and tested before encapsulation and circuitization, ensuring that all Occam assemblies are known good at the outset. There are several methods for adding component connections including traditional plating techniques, additive printed circuits (printed electronics) among others.
The Occam Process does not require high temperature assembly, therefore reliability issues related to high temperatures are eliminated.